IPC-TR-470	Thermal Characteristics of Multilayer Interconnection Boards (多层互连板的热特性)	1/74 (orig. pub.)
IPC-TR-474	An Overview of Discrete Wiring Techniques (分立线路综观)	3/79 (orig. pub.) Reprint 1984
IPC-TR-476	How to Avoid Metallic Growth Problems on Electronic Hardware (如何避免电子硬件的合金化生长)	9/77 (orig. pub.) A 6/84
IPC-TR-480 (作废)	Results of Multilayer Test Program Round Robin IV Phase I	9/75 (orig. pub.)
IPC-TR-481	Results of Multilayer Test Program Round Robin V (多层V循环测试程序的结果)	4/81 (orig. pub.)
IPC-TR-483	Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program (薄层压板尺寸稳定性测试 )	4/84 (orig. pub.) 10/87 Addendums Revised 3/91
IPC-TR-484	Results of IPC Cooper Foil Ductility Round Robin Study (IPC Cooper 箔延展性研究联合报告)	4/86 (orig. pub.)
IPC-TR-485	Results of Cooper Foil Rupture Strength Test Round Robin Study (Cooper 箔断裂强度研究联合报告)	3/85 (orig. pub.)
IPC-TR-549	Measles in Printed Wiring Boards (印制板内的粉点)	11/73 (orig. pub.)
IPC-TR-551	Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components (电子元件安装互连印制板的质量评定)	7/93 (orig. pub.)
IPC-DR-570	General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards (1/8英寸印制板硬质合金钻头总技术规范)	1/79 (orig. pub.) A 4/84
IPC-DR-572	Drilling Guidelines for Printed Boards (印制板钻孔指南)	4/88 (orig. pub.)
IPC-TR-576(已作废)	Additive Process Evaluation	9/77 (orig. pub.)
IPC-TR-578	Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards (前沿制造技术报告---- )	9/84 (orig. pub.)
IPC-TR-579	Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards (印制板小孔金属化可靠性评估联合报告)	9/88 (orig. pub.)
IPC-TR-580	Cleaning and Cleanliness Test Program Phase 1 Test Results (清洗和洁净度测试程序第1阶段测试结果)	10/89 (orig. pub.)
IPC-TR-581	IPC Phase 3 Controlled Atmosphere Soldering Study IPC Phase 3 可控气氛焊接研究)	8/94 (orig. pub.)
IPC-TR-582	IPC Phase 3 No-Clean Flux Study (IPC Phase 3免洗助焊剂研究)	11/94 (orig pub.)
IPC-A-600	Acceptability of Printed Boards (印制 板可接收条件)	orig pub. '64 A '70 B '74 C '78 D '89 E 8/95 F 11/99
IPC-QE-605A	Printed Board Quality Evaluation Handbook (印制板质量评定手册)	Revision A: 2/99
IPC-SS-605	Printed Board Quality Evaluation Slide Set (印制板质量评定,幻灯片)
IPC-A-610	Acceptability of Electronic Assemblies (电子组装的可接收条件)	8/83 (orig. pub.) 2nd printing 1/86 3rd printing 5/88 A 3/90 B 12/94 Amendment 1/96 Revision C: 1/00
IPC-QE-615	Assembly Quality Evaluation Handbook (组装质量评定手册)	3/93 (orig. pub.)
IPC-SS-615	Assembly Quality Evaluation Slide Set (组装质量评定,幻灯片)	3/93 (orig. pub.) Revision A: 2/99
IPC-AI-640 (已作废)	User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates	1/87 (orig. pub.)
IPC-AI-641	User's Guidelines for Automated Solder Joint Inspection (自动焊点检查用户指南)	1/87 (orig. pub.)
IPC-AI-642	User's Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB's (照相底图,内层和PCB裸板自动检查用户指南)	10/88 (orig. pub.)
IPC-OI-645	Standard for Visual Optical Inspection Aids (光学检查目测标准)	10/93 (orig. pub.)
IPC-TM-650	Test Methods Manual (测试方法手册)	Updated per test method
IPC-ET-652	Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards (PCB裸板电气测试要求和导则)	10/90 (orig. pub.)
IPC-QL-653	Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material (检查/测试印制板,元件和材料的设备鉴定)	8/88 (orig. pub.) A 11/97
IPC-MI-660	Incoming Inspection of Raw Materials Manual (原材料来料检查手册)	2/84 (orig. pub.)
IPC-R-700C 被 IPC-7711/ 7721替代	Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies	9/67 (orig. pub.) A 12/71 B 9/77 C 1/88
IPC-TA-720	Technology Assessment Handbook on Laminates (层压板技术评估手册)
IPC-TA-721	Technology Assessment Handbook on Multilayer Boards (多层板技术评估手册)
IPC-TA-722	Technology Assessment of Soldering (焊接技术评估)
IPC-TA-723	Technology Assessment Handbook on Surface Mounting (表面组装技术评估手册)
IPC-TA-724	Technology Assessment Series on Cleanrooms (净化间技术评估)	4/98
IPC-PE-740	Troubleshooting Guide for Printed Board Manufacture and Assembly (印制板制造及组装故障修理指南)	1/85 (orig pub.) A 12/97
IPC-CM-770	Printed Board Component Mounting (印制板元件安装)	9/68 (orig. pub.) A 3/76 B 10/80 C 1/87 D 1/96
IPC-SM-780	Component Packaging and Interconnecting with Emphasis on Surface Mounting (片式元件SMC的封装和互连)	3/88 (orig. pub.)
IPC-SM-782	Surface Mount Design and Land Pattern Standard (表面组装设计和焊盘图形标准)	3/87 (orig. pub.) 9/89 A 8/93 Amendment 1 10/96
IPC-EM-782	Surface Mount Design and Land Pattern Spreadsheet (表面组装设计和焊盘图形电子表格)	9/94 (orig. pub.) Addendum 12/95
IPC-SM-784	Guidelines for Chip-on-Board Technology Implementation (COB技术应用指南)	11/90 (orig. pub.)
IPC-SM-785	Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments (表面组装焊接可靠性加速试验指南)	11/92 (orig. pub.)
IPC-SM-786已被 J-STD-020替代	Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs	12/90 (orig. pub.) A 1/95
IPC-MC-790	Guidelines for Multichip Module Technology Utilization (多芯片模块技术应用指南)	8/92 (orig. pub.)
IPC-S-804被 J-STD-003替代	Solderability Test Methods for Printed Wiring Boards	1/82 (orig. pub.) A 1/87
IPC-S-805被 J-STD-002替代	Solderability Tests for Component Leads and Terminations	1/85 (orig. pub.)
IPC-MS-810	Guidelines for High Volume Microsection (显微切面指南)	10/93 (orig. pub.)
IPC-S-815被 J-STD-001替代	General Requirements for Soldering Electronic Interconnections (已废除,由J-STD-001替代)	11/77 (orig. pub.) A 6/81 B 12/87
IPC-S-816	SMT Process Guideline and Checklist ( SMT工艺指南和检查表)	7/93 (orig. pub.)
IPC-SM-817	General Requirements for Dielectric Surface Mounting Adhesives (绝缘性表面组装胶粘剂通用规范)	11/89 (orig. pub.)
IPC-SF-818 被 J-STD-004替代	General Requirement for Electronic Soldering Fluxes (用于电子组件焊接的助焊剂通用技术要求)	2/88 (orig. pub.) 12/91
IPC-SP-819 被J-STD-005替代	General Requirements and Test Methods for Electronic Grade Solder Paste	10/88 (orig. pub.)
IPC-AJ-820	Assembly and Joining Manual (组装和连接手册)	8/96 (orig. pub.)
IPC-CA-821	General Requirements for Thermally Conductive Adhesives (热导胶粘剂通用技术要求)	1/95 (orig. pub.)
IPC-CC-830	Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies (印制板组装电绝缘材料的鉴定和性能)	1/84 (orig. pub.) 4/90 Reaffirmed A 10/98
IPC-SM-839	Pre and Post Solder Mask Application Cleaning Guidelines (焊接前,后阻焊膜的清洗指南)	4/90 (orig. pub.)
IPC-SM-840	Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards (印制板阻焊膜的鉴定和性能)	11/77 (orig. pub.) A 7/83 B 5/88 C 1/96
IPC-H-855 (己作废)	Hybrid Microcircuit Design Guide	10/82 (orig. pub.)
IPC-D-859	Design Standard for Thick Film Multilayer Hybrid Circuits (厚膜多层混合电路设计标准)	12/89 (orig. pub.)
IPC-HM-860	Specification for Multilayer Hybrid Circuits (多层厚膜电路技术规范)	1/87 (orig. pub.)
IPC-TF-870	Qualification and Performance of Polymer Thick Film Printed Boards (聚合物厚膜印制板的鉴定和性能)	11/89 (orig. pub.)
IPC-D-949被IPC-D-275替代	Design Standard for Rigid Multilayer Printed Boards	1/87 (orig. pub.)
IPC-ML-950被 IPC-RB-276替代	Performance Specification for Rigid Multilayer Printed Boards	1/66 (orig. pub.) A 9/70 B 12/77 C 11/86
IPC-ML-960	Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards (多层印制板预制内层敷箔板的鉴定和性能规范)	7/94 (orig. pub.)
IPC-ML-975 被IPC-D-325替代	End Product Documentation Specification for Multilayer Printed Wiring Boards	9/69 (orig. pub.)
IPC-ML-990 (作废)	Performance Specification for Flexible Multilayer Wiring	9/72 (orig. pub.)
IPC-1402/IPC-H-855	Hybrid Microcircuit Design Guide (混合微波电路设计指南)	10/82 (orig. pub.)
IPC-1710	OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP印制板OEM制造商资格鉴定一览表)	2/94 (orig. pub.) 12/97 updated
IPC-1720	Assembly Qualification Profile (AQP印制板组装制造商资格鉴定一览表)	7/96 (orig. pub.)
IPC-1730	Laminator Qualification Profile (LQP) (层压板制造商资格鉴定一览表)	1/98
IPC-2141	Controlled Impedance Circuit Boards and High Speed Logic Design (阻抗调制电路板和高速逻辑电路设计)	4/96 (orig. pub.)
IPC-2221 代替 IPC-D-275	Generic Standard on Printed Board Design (印制板设计通用标准)	2/98(orig. pub.)
IPC-2222 代替 IPC-D-275	Sectional Design Standard for Rigid Organic Printed Boards (刚性有机印制板设计标准)	2/98(orig. pub.)
IPC-2223	Sectional Design Standard for Flexible Printed Boards (柔性印制板设计标准)	11/98
IPC-3406	Guidelines for Electrically Conductive Surface Mount Adhesives (表面组装导电胶导则)	7/96 (orig. pub.)
IPC-3408	General Requirements for Anistropically Conductive Adhesive Films (各向异性导电胶粘剂通用技术要求)	11/96 (orig.pub.)
IPC-4101 代替 IPC-L-108/109 IPC-L-112/115	Specification for Base Materials for Rigid and Multilayer Boards (刚性及多层印制板基材特性规范)	12/97 (orig. pub.)*
IPC-4110	Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards (非织物纤维纸印制板的特性和规格)	8/98*
IPC-4130	Specification and Characterization Methods for Nonwoven "E" Glass Mat (非织物‘E’玻璃垫规范)	9/98*
IPC-6011	Generic Performance Specification for Printed Boards (印制板通用性能规范)	7/96 (orig. pub.)*
IPC-6012	Qualification and Performance Specification for Rigid Printed Boards (刚性印制板的鉴定与性能规范)	7/96 (orig. pub.) A 10/99
IPC-6013	Qualification and Performance Specification for Flexible Printed Boards (柔性印制板的鉴定与性能规范)	11/98
IPC-6015	Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures (有机多芯片模块(MCM-L)组装及互连结构的鉴定和性能规范)	2/98 (orig. pub.)
IPC-6018	Microwave End Product Board Inspection and Test (微波产品电路板的检查和测试)	1/98(orig. pub.)
IPC/JPCA-6202	Performace Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards (单、双面柔性印制电路板性能指导手册)	2/99
IPC-7711 代替 IPC-R-700C	Rework of Electronic Assemblies (电子组件的返修)	4/98 (orig. pub.)
IPC-7721 代替 IPC-R-700C	Repair and Modification of Printed Boards and Electronic Assemblies (印制板和电子组件的修理和调整)	4/98 (orig. pub.)
IPC-9191代替IPC-PC-90	General Guideline for implementation of Statistical Process Control (SPC) (SPC实施通则)	11/99 (orig.pub)
IPC-9201	Surface Insulation Resistance Handbook (表面绝缘电阻手册)	7/96 (orig. pub.)
IPC-9501	PWB Assembly Process Simulation for Evaluation of Electronic Components (电子元件组装工艺仿真的评价)	7/95 (orig. pub.) Revision A: In process
IPC-9504	Assembly Process Simulation for Evaluation of Non-IC Components (非IC器件组装工艺仿真的评价)	6/98