当前位置:首页 >> 技术文章 >> 正文

IEC2007年10月上旬发布的标准

【来源:CESI】【作者:童晓明编译整理】【时间: 2007-10-30 8:41:10】【点击:


标准号

版本

发布

时间

英文题目

中文题目

分类代码

TC/SC

ISO/IEC CASCO-CONF

1.0

18 October 2007

Conformity assessment - Certification and inspection bodies

 

03.120.20; 01.040.03

 

SC CASCO

IEC 60747-16-2-am1

1.0

18 October 2007

Amendment 1 - Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers

 

31.080.01

SC 47E

IEC 62366

1.0

18 October 2007

Medical devices - Application of usability engineering to medical devices

 

11.040.

SC 62A

IEC 60976

2.0

16 October 2007

Medical electrical equipment - Medical electron accelerators - Functional performance characteristics

 

13.280. ; 11.040.50

SC 62C

CISPR 16-1-4-am1

2.0

16 October 2007

Amendment 1 - Specification for radio disturbance and immunity measuring apparatus and methods - Part 1-4: Radio disturbance and immunity measuring apparatus - Ancillary equipment - Radiated disturbances

 

33.100.10; 33.100.20

SC CIS/A

CISPR 16-1-1

2.2

16 October 2007

Specification for radio disturbance and immunity measuring apparatus and methods - Part 1-1: Radio disturbance and immunity measuring apparatus - Measuring apparatus

 

33.100.10

SC CIS/A

IEC 60904-9

2.0

16 October 2007

Photovoltaic devices - Part 9: Solar simulator performance requirements

 

27.160.

TC 82

CISPR 16-SER

1.0

16 October 2007

Specification for radio disturbance and immunity measuring apparatus and methods - ALL PARTS

 

33.100.10; 33.100.20

 

SC CIS/A

ISO/IEC 10373-6-am5

1.0

11 October 2007

Amendment 5 - Identification cards - Test methods - Part 6: Proximity cards - Bit rates of fc/64, fc/32 and fc/16

 

35.240.15

SC JTC 1/SC 17

ISO/IEC 7816-2

2.0

11 October 2007

Identification cards - Integrated circuit cards - Part 2: Cards with contacts - Dimensions and location of the contacts

 

35.240.15

SC JTC 1/SC 17


下一篇:没有了
最新文章
 IEC2007年10月上旬发布的标
用标准的SMT线来组装光电子印
SMT环境中的最新复杂技术
IPC-TM-650铜箔的拉力强度和
IEC2007年8月中旬发布的标准
如何将ROSH对成本影响控制在
烙铁头闲置温度与热能传递的
电镀针孔产生的原因分析
电子装配对无铅焊料的基本要
电子装配对无铅焊料的基本要
电子装配对无铅焊料的基本要
适合QFN返修的焊膏印刷
线路板焊接方面的基本知识
再流焊炉的选用原则
高密度电子封装的最新进展和
热点文章
IPC标准
《IPC-9850表面贴装设备性能检
欧盟双指令(WEEE/ROHS指令案)
IPC技术标准目录之 电 子 组 装
焊锡膏使用常见问题分析
如何有效控制湿度敏感器件
现代PCB测试的策略
IPC-9850表面贴装设备性能检测
BGA封装形式对再流焊效果的影响
高密度封装进展(之一)
CSP引发内存封装技术的革命
线路板装配中的无铅工艺应用原
线路板装配中的无铅工艺应用原
线路板装配中的无铅工艺应用原
线路板装配中的无铅工艺应用原
会员名称:
密码:匿名 ·注册·忘记密码?
评论内容:
(最多300个字符)
  查看评论