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标准号 |
英文题目 |
中文题目 |
技术机构 |
发布日期 |
适用指令 |
|
EN 60745-2-18:
2004/A11:2007 |
Hand-held motor-operated electric tools - Safety -- Part 2-18: Particular requirements of strapping tools |
手控工作电机电动工具—安全性---第2-18部分：剥离工具专门要求 |
CLC/TC 61F
IEC/SC 61F |
2007-06-29 |
98/37/EC |
|
EN 60745-2-20:
2003/A11:2007 |
Hand-held motor-operated electric tools - Safety -- Part 2-20: Particular requirements for band saws |
手控工作电机电动工具—安全性---第2-20部分：带锯专门要求 |
CLC/TC 61F
IEC/SC 61F
|
2007-06-29 |
98/37/EC |
|
EN 60745-2-9:
2003/A11:2007 |
Hand-held motor-operated electric tools - Safety -- Part 2-9: Particular requirements for tappers |
手控工作电机电动工具—安全性---第2-9部分：键的专门要求 |
CLC/TC 61F
IEC/SC 61F |
2007-06-29 |
98/37/EC |
|
EN 60670-21:
2007 |
Boxes and enclosures for electrical accessories for household and similar fixed electrical installations -- Part 21: Particular requirements for boxes and enclosures with provision for suspension means |
家用和类似固定电气装置电气附件用盒子和箱子---第21部分：规定采用悬吊法的盒子和箱子的专门要求 |
CLC/TC 23B
IEC/SC 23B |
2007-06-29 |
2006/95/EC |
|
EN 60068-3-11:
2007 |
Environmental testing -- Part 3-11: Supporting documentation and guidance - Calculation of uncertainty of conditions in climatic test chambers |
环境试验---第3-11部分：支撑文件和指南---对环境试验箱中不确定条件的考虑 |
CLC/SR 104
IEC/TC 104 |
2007-06-28 |
|
|
EN 61190-1-3:
2007 |
Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
电子组装用附连材料---第1-3部分：电子焊接用电子级焊料合金和有芯和无芯焊剂固体焊料要求 |
CLC/SR 91
IEC/TC 91 |
2007-06-28 |
|
|
EN 61190-1-2:
2007 |
Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
电子组装用附连材料---第1-2部分：电子焊接用高质量互连用焊膏要求 |
CLC/SR 91
IEC/TC 91 |
2007-06-28 |
|
|
EN 61760-2:
2007 |
Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
表面安装技术---第2部分：表面安装器件(SMD) 的装运和储存---应用指南 |
CLC/SR 91
IEC/TC 91 |
2007-06-28 |
|
|
EN 61192-5:
2007 |
Workmanship requirements for soldered electronic assemblies -- Part 5: Rework, modification and repair of soldered electronic assemblies |
焊接的电子组装件制作质量---第5部分：焊接的电子组装件的返工、修改和修理 |
CLC/SR 91
IEC/TC 91 |
2007-06-27 |
|
|
EN 61300-2-22:
2007 |
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 2-22: Tests - Change of temperature |
光纤互连器件和无源元件---基本试验和测量方法---第2-22部分：试验---温度变化 |
CLC/TC 86BXA
IEC/SC 86B |
2007-06-22 |
|
|
EN 60068-2-82:
2007 |
Environmental testing -- Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components |
环境试验---第2-82部分：试验---试验Tx：电气和电子元器件晶须试验方法 |
CLC/SR 91
IEC/TC 91 |
2007-06-22 |
|
|
EN 61300-2-26:
2007 |
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 2-26: Tests - Salt mist |
光纤互连器件和无缘元件---基本试验和测量方法---第2-26部分：试验---盐雾试验 |
CLC/TC 86BXA
IEC/SC 86B |
2007-06-22 |
|
|
EN 60793-1-42:
2007 |
Optical fibres -- Part 1-42: Measurement methods and test procedures - Chromatic dispersion |
光纤---第1-42部分：测量和试验程序---色散 |
CLC/TC 86A
IEC/SC 86A |
2007-06-22 |
|
|
EN 60068-2-69:
2007 |
Environmental testing -- Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method |
环境---第2-69部分：试验---试验Te：表面安装器件(SMD)的电子元器件可焊性试验，润湿称量法 |
CLC/SR 91
IEC/TC 91 |
2007-06-22 |
|
|
EN 61290-7-1:
2007 |
Optical amplifiers - Test methods -- Part 7-1: Out-of-band insertion losses - Filtered optical power meter method |
光学放大器---试验方法---第7-1部分：谱带外插入损失---滤光计法 |
CLC/SR 86C
IEC/SC 86C |
2007-06-21 |
|
|
EN 60793-1-47:
2007 |
Optical fibres -- Part 1-47: Measurement methods and test procedures - Macrobending loss |
光纤---第1-47部分：测量和试验程序---宏弯损耗 |
CLC/TC 86A
IEC/SC 86A |
2007-06-21 |
|
|
EN 61291-2:
2007 |
Optical amplifiers -- Part 2: Digital applications - Performance specification template |
光学放大器---第2部分：数字应用---性能规格模板 |
CLC/SR 86C
IEC/SC 86C |
2007-06-21 |
|
