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金线,铝线压焊机制作过程
【英文标题】Study of Parameters for Thermosonic Wire Bonder
【关 键 词】焊线机 邦定机 压焊机 铝丝焊线机金丝焊线机 铝丝压焊机 金丝压焊机帮定机 金线压焊机 铝线压焊机金线结球路径成型类神经网络田口
【论文类别】 毕业论文
【中文摘要】焊线在半导体封装中占有举足轻重的地位，影响焊线品质的因素有：焊接温度、超音波功率、焊接力量、焊接时间金球大小、路径长度及路径高度等。对应于这些参数在焊线机制程的关键技术，可分为金线结球及焊线路径稳定性两个部分。影响金线结球好坏的参数有：（1）线尾长度（2）钢嘴型式（3）金线材质（4）放电产生器的电压、电流、时间的大小长短（5）金线与电击板的间隙大小（6）电击板和钢嘴的相对位置。影响路径稳定性的参数则有（1）FAB的热影响区长度（2）一焊点Smash Ball大小及剪力强度（3）一、二焊点拉力强度（4）路径转折长度（5）路径转折角度（6）三轴同动的参数控制。本文将针对焊线品质的影响参数进行探讨，透过田口式实验统计方法，来建立分析模式，并结合类神经网络，以找出最适的参数设定，做为制程参数最佳化及监控管理的依据，且期望能应用于设备开发与其它制程上。
【英文摘要】 Wire bonding is a very important part in the semiconductor packaging, the parameters which affect the bonding quality includes：Bonding temperature 、Ultrasonic power、Bonding force、Bonding time、Free air ball size、Loop Length and Loop Height etc. Considering these factors, the flowing two parts should be considered in the wire bonding process：Free air ball formation and Looping stability. The parameters which affect the free air ball formation includes：（1）The tail length left after second bond（2）The type and shape of capillaries used（ 3）The material characteristics of gold wire（4）The supplied voltage, current and time of electrical flame-off (EFO)unit（5）The gap between tail and electrode plate（6）The relative position between capillary and electrode plate. The parameters which affect the Loop stability includes：（1）Heat affect zone (HAZ) of Free Air Ball (FAB)（2）Smash ball size and shear force（3）Wire pull force（4）Loop reverse length（5）Loop reverse angle（6）Factors in the three axis motion. In this paper, the study will focus on the effect of these parameters to the bonding quality, Taguchi Technique and neural network are applied in this study to establish the model and find the best parameters setting for wire bonding. It can then be used for wire bonding process parameter adjustment and process monitoring. It can also be used as reference for the development of equipment and other process |
