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PALO ALTO, Calif., May 10, 2005 (BUSINESS WIRE) -- The rising number of participants and falling brand loyalty in the semiconductor marketplace are intensifying competition-compelling participants to offer maximum differentiation with unique value-added products and services.
Back-end semiconductor manufacturing technologies such as lead-free wafer bumping and novel electronic packaging technologies are emerging as a means of creating high performance semiconductor devices and thus gaining a competitive edge in a crowded market. Rising awareness about Restriction of Hazardous Substances (RoHS) initiatives also propels participants to innovate lead-free processes.
Growing environmental concerns from authorities such as the European Union and end-user demand for technically superior low-cost products furthers this constant innovation.
If you are interested in an analysis, which provides manufacturers, end users, and other industry participants with an overview, summary, challenges, and latest coverage of World Back-end Semiconductor Manufacturing Technologies - then send an e-mail to Trisha Bradley - North American Corporate Communications at trisha.bradley@frost.com with the following information: your full name, company name, title, telephone number, fax number, and e-mail. Upon receipt of the above information, an overview will be sent to you via e-mail.
Participants work towards lead-free alternatives such as tin-silver-copper (Sn-Ag-Cu), also called as the SAC system, combined with materials such as gold. However, the slow adoption of these processes is due to materials related issues such as high yield loss and low reliability.
"The major difference between eutectic tin-lead solder and SAC lead-free solder is the high reflow temperature. A temperature increase of 30 degrees C can affect many aspects of the process and equipment," explains Frost & Sullivan Research Analyst Sivakumar Muthuramalingam. "Further, the major challenge with lead-free materials is the possibility of tin whiskers."
The high fatigue characteristic of lead-free alloys results in temperature challenges causing flux problems, which can adversely impact a process.
"The integration of lead-free materials into FC/chip scale package (CSP) applications is difficult due to the material properties such as stiffness and compliance, thereby increasingly making reliability an issue," points out Muthuramalingam.
Constant innovation and enhanced products such as electroless nickel bump, stencil printing, and electroplating will also allow combating the problem of a lack of standards in the packaging industry where several designs are utilized for the same package.
Going forward, greater standardization of electronic packaging technologies, race toward miniaturization of electronic devices, and rise in demand for consumer electronics is likely to sustain end-user interest in next-generation back-end semiconductor manufacturing technologies.
World Back-end Semiconductor Manufacturing Technologies is a part of the Semiconductor vertical subscription service (D918), and provides an in-depth analysis of the latest trends in back-end semiconductor manufacturing technologies. It also looks at the future size and structure of the back-end semiconductor contract manufacturing industry. The research service also analyzes the key technology drivers, and evaluates the challenges that must be overcome for each novel back-end semiconductor manufacturing technology to realize its potential. This vital information will allow participants to effectively plan for the long term and identify and maximize all opportunities for growth. Executive summaries and interviews are available to the press.
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World Back-end Semiconductor Manufacturing Technologies
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Keywords in this release: back-end semiconductor manufacturing technologies, European Union, Restriction of Hazardous Substances (RoHS), tin-silver-copper - Sn-Ag-Cu, SAC system, gold, copper, high yield loss, flip-chip, FC, PbSn, lead-tin, board assembly, underfill, substrate warpage, thermal mismatch, reflow, eutectic tin lead solder, flip chip/chip scale package, FC/CSP
SOURCE: Frost & Sullivan
CONTACT: Frost & Sullivan Corporate Communications - North America Trisha Bradley, 210-247-3870 Fax: 210-348-1003 trisha.bradley@frost.com or Corporate Communications - Europe Magdalena Oberland, +44 (0) 20 7915 7876 Fax: +44 (0) 20 7730 3343 magdalena.oberland@frost.com or Corporate Communications - Asia Pacific Pramila Gurtoo, DID: (603) 6204 5811 Gen: (603) 6204 5800 Fax: (603) 6201 7402 pgurtoo@frost.com www.frost.com www.technicalinsights.frost.com |
