|
职位描述：
Requirements:
1.Undergraduate degree in Mechanic, Electronic Mechanic, Electronic Engineering or equivalent.
2.Three years minimum experience in Production or Manufacturing Engineering in Semicon Assembly House. Experience with Wire Bonding / Dicing is preferred.
3. Qualified English oral & writing ability is required (CET 06).
4. Requires a self-motivated individual that has the ability to manage complex projects and processes.
5. Additionally this individual must have demonstrated the ability to establish processes and process controls using statistical methods.
Responsibilities:
1. Transfer NPI projects (mainly for WB and Dicing process) from R&D center to production line
2. Maintain process specifications, bill of materials, routings, operational standards, and work instructions in Wire Bond and Dicing process.
3. Initiates, evaluates and documents trials on new process..
4. Initiates and implements cost reduction ideas, product changes and redesigned products; issues appropriate specifications and coordinates special feasibility projects.
5. Assists Marketing and Quality Assurance in solving customer complaints regarding product problems.
6. Assists in the design, prototyping, and qualification of new production systems.
7. Investigates and evaluates new manufacturing technologies, equipment and materials to find innovative ideas for more efficient manufacturing methods.
8. Assists in transferring of Silicon Microphone processes to our subcontract manufacturers.
9. Trains subcontract manufactures on new products, production methods, and equipment. Also provides guidance and training to new & inexperienced engineers.
|
