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职位描述：
In an effort to significantly enhance assembly technology capabilities at Flextronics in Asia, the “Asia Assembly Technology Center”, a branch of the Flextronics Corporate Technology Group, is being established in Doumen, China.
Responsibility
1.Report directly to the Corporate Technology Group.
2.Manage assembly technology development, transfer & factory qualification programs and machine evaluations in Asia.
3.Develop new Surface Mount Technologies and advanced packaging and PCB assembly processes based on the Flextronics Corporate Technology Roadmap.
4.Implement, Qualify, Train and Support new Surface Mount Technologies and packaging technologies in various Flextronics manufacturing sites worldwide.
5.Work closely with design centers and ensure consistency between assembly technology, factory capability and Design For Manufacturing requirements
Competence
1.Bachelor's Degree; MS/Ph.D. preferred.
2.Minimum 8 years experience with Surface Mount Technology and/or packaging technology in a high volume environment.
3.Extensive knowledge with hands-on experience in Surface Mount Technology including screen printing, pick & place, reflow, adhesive dispensing, and different interconnection and electronics packaging methods.
4.Experience in lead-free soldering and miniaturization technology (such as 0201, fine pitch CSP’s and Flip Chip technologies).
5.Highly skilled and good interpersonal skills; can work independently.
6.Excellent communication skills.
7.Strong experience in managing teams.
Work Location:Zhuhai
Please send your resume,stating current and expected salary to:
Email:jobs.hr1@cn.flextronics.com |
