职位描述： Responsibilities 1.In charge of new project,Based on FCOB (Flip-Chip On Broad) & QFN 2.Evaluating related Packaging reliability 3.Transfer engineering sample development to volume Production Run Requirements: 1.2+ Yrs working experiences on the following Packaging field:QFN Plastic Molding & Separation; FLIP-CHIP Bonding; Plastic BGA Assembly; Wafer Level Packaging 2.Strong theoretical backgrou and in material and microelectronics 3.Proficient in English ,spoken and written 4.Good at team work.
