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Indium Corporation of America will be exhibiting at IPC Printed Circuits Expo, APEX, the Designers Summit in Anaheim, CA on February 22-24, 2005.
Indium's exhibit will feature advanced technologies in Pb-Free electronic assembly with cutting edge materials. Their offering will span a full range of PCB assembly materials, including solder paste, wave solder fluxes, rework materials and solder fabrications, such as solder preforms, solder ribbon and wire, and solder spheres.
Indium will be exhibiting at booth #635. Experts will be readily available at the booth to answer questions on Pb-Free assembly, and articles and information will also be available.
IPC/APEX is one of the largest shows in the electronics interconnection industry. It attracts over 500 exhibitors and features almost 60 full-or half-day educational courses and offers one of the largest networking opportunities in the world.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.
For more information on Pb-Free electronic assembly or Indium Corporation, visit www.pb-free.com or www.indium.com , or email askus@indium.com.
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