IPC近日宣布了2006－2007年IPC国际电子互联技术路线图。
Published every two years, the IPC Roadmap provides vision and direction for product and process development and services to satisfy the informational needs of companies manufacturing substrates and assemblies.
"Unlike other roadmaps, the IPC International Technology Roadmap is the only one that exclusively focuses on the printed circuit board and electronics assembly industries," said Dieter Bergman, IPC's director of technology transfer. "While a view from 20,000 feet can provide a valuable, broad brush of information, IPC's Roadmap is purposely designed to provide meaningful insight at an operational level - so companies gain acute understanding for virtually every operation on the manufacturing floor."
The "2006–2007 IPC International Technology Roadmap for Electronic Interconnections" is a valuable addition to any company's technology resource library. As an IPC member benefit, the Roadmap is available as a free download to IPC members at www.ipc.org/membersonly.
The Roadmap can be purchased in a user-friendly CD format. The CD includes extensive linking between sections and an easy-to-use "front end" for navigation. The CD can be purchased by members for $125 and by non-members for $250.
For additional information on the IPC Roadmap, contact Dieter Bergman at +1 847-597-2839 or DieterBergman@ipc.org, or Jack Fisher, Interconnect Technology Analysis, Inc., at +1 512-930-5666 or fish5er@mindspring.com.
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