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David Sbiroli, Senior Applications Engineer with Indium Corporation of America, will be presenting at the IMAPS 2005 Symposium on Electronic Technology Advancements in Arlington Heights, IL on Wednesday, April 20, 2005.
David’s presentation is entitled, “Lead-Free Soldering in Hybrid Microelectronics”. This presentation covers the materials and process considerations that must be made when converting a hybrid assembly process to Pb-Free.
David is an SMTA Certified Processing Engineer (CPE) and has over twelve years experience in the electronics industry.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.
For more information on lead-free soldering, visit Indium Corporation of America at www.indium.com or email askus@indium.com.
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2005-2-19 |
