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Indium Corporation will exhibit at IMAPS MicroTech 2005 on March 1 & 2. The show is taking place at the Moller Conference Center in Cambridge, England, features Photonics, Power Packaging, Flip-Chip Technology, and Packaging Reliability.
Indium Corporation’s exhibit will focus on Semiconductor, Power Semiconductor, and Specialty Solder Materials, including Solder Wire, Solder Preforms, Tape & Reel Preforms, Bumping Pastes, TACFluxes and Underfills. In addition, Indium will feature Pb-Free Solder Alloys and Solder Applications, such as Die Attach, Solder Fortifications, Package Construction, and SMT Mixed-Technology.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials. The company is also the world’s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.
For more information, visit Indium Corporation at www.indium.com or email askus@indium.com.
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2005-2-24 |
