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Indium’s Dr. Lee and Dr. Lasky to Present at APEX

【来源:smta.org.cn】【编辑:toptouch】【时间: 2005-1-13 9:41:16】【点击:

PRESS RELEASE

Contact:

Rick Short

Director: Corporate Communications

Indium Corporation

rshort@indium.com

tel: +1.315.381.7554

34 Robinson Road

Clinton, NY 13323 USA

www.indium.com

Indium’s Dr. Lee and Dr. Lasky to Present at APEX

Indium Corporation’s VP of Technology, Ning-Cheng Lee, Ph.D and Senior Technologist, Ronald C. Lasky, Ph.D., PE, will both be presenting courses on Pb-Free electronic assembly at APEX in Anaheim, CA in February.

Dr. Lee will be presenting “Lead-Free Soldering – Metallurgical Fundamentals, Reflow Applications and Challenges” on Monday, Feb. 21, 2005 from 8:30 a.m. – 4:30 p.m. Dr. Lee is a world-renown soldering expert and also has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.

His course will cover all the fundamental design considerations of Pb-Free alloys, with emphasis on metallurgical properties analysis. The performance of representative alloys on reflow soldering will be discussed, along with major challenges, with a focus on metallurgical causes.

Dr. Lasky’s topic is “Best Practices in Implementing Lead-Free Assembly” and he will also be presenting on Monday, February 21 from 8:30 a.m. – 4:30 p.m. Dr. Lasky, a holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and visiting professor at Dartmouth College. He has over 20 years of experience in electronic and optoelectronic packaging and assembly.

His course will focus on all the “how to’s” of implementing Pb-Free. It covers every issue, such as PCB finishes, components, alloys and SMT processes. It also reviews several actual implementations of Pb-Free processing and will conclude with a Pb-Free implementation plan to be used by July1, 2006.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.

For more information about Pb-Free issues visit Indium Corporation of America at www.pb-free.com or email askus@indium.com.

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Indium Corporation<|||>
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深圳拓普达资讯有限公司<|||>
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2005-1-13

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