As CSP, 0201, and 01005 technology is becoming more mainstream, PCB assemblers are challenged with achieving high solder paste transfer efficiency through small stencil apertures. Indium8.9 was formulated to produce consistent print volumes through apertures below the industry recommended minimum area ratio of 0.66.
From cell phones to Mother Boards – Indium8.9 does it all. Indium8.9 exhibits low voiding (<5%) over many different profiles when soldering BGAs with via-in-pad technology. It also offers a very robust processing window that can minimize potential defects, as well as accommodate various board sizes and throughput requirements.
Indium8.9 was specially designed to be extremely thermally stable and maintain a soft, pliable residue after reflow. This means easier probe-testability and fewer false rejects during in-circuit testing.
The performance benefits customers obtain by using Indium8.9 result in increased cost savings and the highest finished goods reliability.
Indium will be exhibiting at Booth 747
For more information about Indium8.9 No-Clean Pb-Free Solder Paste visit www.indium.com or email abrown@indium.com.
