摘要：本文利用有限元软件MARC模拟分析了PBGA经红外回流升温过程的变形机理。由分析结果得知，PBGA在受热后，由于材料的性能差异而导致PBGA发生翘曲，随温度上升PBGA会往上翘曲，当温度达到模塑封材料的玻璃转化温度时趋势反转，由基板主导的翘曲趋势改为由模塑封材料主导，从而使翘曲开始有往下的趋势。降低基板与模塑封材料的热膨胀系数是降低PBGA翘曲的一种解决方法。
关键词：模塑封材料；热膨胀系数；玻璃转化温度；有限元模拟；翘曲
中图分类号：TM931 文章标识码：A
Study of the warpage mechanism of PBGA via IR-Reflow Process
Guo Dan1
(Guilin University of electronic technology, Guilin 541004，china)
Abstract：The main objective of this research is to studying the deformation mechanism of PBGA via IR-Reflow process by utilizing the Finite Element Method and assuming that the PBGA components are made in perfect plastic materials . we can receive the result from the simulation of the PBGA, the warpage will be taken place when the PBGAis heated due to the difference of the materials, the warpage will be upgrade along with the raising of the temperature, the main factor of the the warpage is the material parameter of the substrate. the warpage trend will be reversedwhen the temperature reachs Tg, at that time the main factor of the the warpage is the material parameter of the EMC. Reduce the CTE of the substrate and EMC is one of the solution the reduce the warpage of the PBGA.
Key word: Molding Compound; Coefficient of Thermal Expansion; glass transition temperature; Finite Element Method; Warpage
