[设为首页] [加入收藏[繁体中文]

  当前位置:首页 >> 培训专区 >> 培训课程介绍 >> 正文

培训动态 | 培训课程介绍 | 培训课程安排 | 专家介绍 | 顾问服务
培训证书查询
姓名 证书编号

“电子封装和PCB组装的材料、工艺和可靠性”学术讲座

【来源:深圳市拓普达资讯有限公司培训部】【编辑:toptouch】【时间: 2006-6-16 15:12:38】【点击:

本公司竭诚为企业提供内部培训。企业内部培训人数不受限制,培训时间由企业灵活制定。
 
中国电子学会SMT咨询专家委员会办事处
中国电子专用设备工业协会
美国SMTA深圳办事处
梁晋博士“电子封装和PCB组装的材料、工艺和可靠性”学术讲座

前言:
电子产品日益小型化高功耗和环保要求对电子封装和PCB组装以及材料供应商提出了许多挑战。在这次讲座中我们将详细讲解电子元件封装和PCB组装技术以及工艺,并了解组装材料和工艺对最终产品质量和可靠性的影响。例举并讨论组装材料,例如焊料合金、焊膏、助焊剂和芯片粘接材料的主要特性,及评估认证这些材料和工艺优化的方法。对HoHS和无铅加工技术和可靠性进行深入的探讨。进一步,我们将回顾发生在电子元器件和PCB组装中的主要失效机理。我们将以实际案例来讲解产品可靠性评估,寿命预测,HALT/ESS试验方法。
The drive to ever-increased miniaturization, high power dissipation, and more environment-friendly electronics products, presents many challenges not only to the OEMs, but also to packaging houses and PCB assemblers, as well as to material suppliers.  In this lecture we will examine the critical characteristics of assembly materials, such as solder alloys, pastes, fluxes, and die attach materials, by detailed study of component packaging and PCB assembly technologies and processes, and by understanding the effects of these assembly materials and processes on the final product reliability.  Methodologies for assembly materials evaluation, qualification, and process optimization are presented and discussed.  Furthermore, we will review major failure mechanisms operative in electronics components and PCB assemblies.  Practical methods and tools for product reliability assessment, life prediction, HALT/ ESS testing are also presented with actual case studies and examples.

 授课对象:
本课程着力推荐给电子封装和印刷线路板组装领域内的专业人士,包括技术主管,工艺开发工程师,设计和产品工程师/经理和组装材料供应商。
This class is recommended for professionals in the field of electronics packaging and board assembly, including technical directors, processes development engineers, design and production engineers/managers, and assembly materials suppliers.

本课程将涵盖以下主题
主题
Topics
1、   简介
2、   目前和将来的半导体技术和纳米电子
3、   一级元件封装技术和工艺
4、   板级焊接技术—回流和波峰焊
5、   电子元件封装和印刷电路组装材料
6、   组装材料评估和认证方法,包括RoHS无铅工艺 
7、 锡晶须形成及防范措施 
8 电子封装和PCB组装常见失效机理
9 热传导和热应力分析
10电子元器件和系统可靠性评估,寿命预测和HALT/ESS测试
 
 
Ø   Introduction
Ø       Current and future semiconductor technology, and nano-electronics
Ø       First level component packaging technology and processes
Ø       Board level soldering technology - reflow and wave soldering
Ø       Materials for electronics component packaging and printed circuit assembly
Ø       Board level assembly materials evaluation and qualification methodology, including for RoHS compliance lead-free processing 
Ø    Tin whisker formation and mitigation strategy
Ø       Common failure mechanisms in electronic packages and PCB assemblies
Ø       Thermal and stress analyses for first-level and second level interconnections
Ø       Reliability assessment, life predictions, and HALT/ESS testing of electronic components and systems.
 
 
培训费用会员价:¥2000元/2天/人
  非会员价:¥2300元/2天/人(SMTe会员)
四人以上团体报名可获得非会员价的8折优惠价
 
(含教材费、听课费、咨询费、培训证书费、工作午餐费、茶水费,其余食宿交通自理 )
 
咨询电话:(0755)8619-6415    8619-6417   8619-6419
联络传真:(0755)8619-6414 
联系人:徐桃英,沈丽,李群,董艳,郭艳梅
 

讲师-梁晋博士
梁先生于1992年在美国麻省理工学院获得博士学位,后在麻省理工做博士后研究员,主要研究结构可靠性和先进材料断裂微机理。1994年到1998年,他在美国洛克韦尔国际公司工作,担任高级研究员和项目经理。1998年他加入总部设在美国麻州的EMC公司(全球最大的信息存储系统生产商 ),现任该公司的的科学顾问致力于电子封装技术开发,IC、PCB/PCBA制造工艺的研究和可靠性评估。梁博士曾被Marquis载入世界科技名人录,曾任ASM电子材料委员会主席。他撰写了很多材料失效物理方面的技术文章,拥有多项电子制造工艺和设计专利。
Dr. Jin Liang is a science consultant at EMC Corporation (Boston based company, the world leader for information storage systems and solutions), responsible for electronic packaging technology development and interconnect design, IC, PCB/PCBA manufacture process development and optimizationas well as reliability assessment Mr. Liang earned his PhD degree from M.I.T in 1992.  After graduation, he worked as a research associate at MIT on study of aged airplane reliability and micro-mechanisms of fracture for advance materials.  Prior to joining EMC Corp, he worked at Rockwell International from 1994 to 1998 as a senior research scientist.  Dr. Liang was once honored in Marquis's Who Is Who in Science and Technology and served as a former ASM Electronic Materials Characterization Committee Chairperson.  He has extensive technical publications on fundamental material failure physics, and owns several electronic process and design patents.

我要报名(请填妥附件中的报名表,传真或mail至本培训中心)
 
银行资料
开户银行:招商银行深圳市南油支行
公司名称:深圳市拓普达资讯有限公司
公司账号:2583640910001

·其他相关文章·
上一篇:“无铅焊接材料和工艺技术”学术讲座
下一篇:“锡须:测试方法、机理和预防”学术讲座