Tin whiskers, growing spontaneously from Sn and Sn alloy coatings, can cause electrical shorts in the circuit and present a long-term reliability problem to the electronic industry. Extensive work has been performed in the last fifty years to understand the mechanism of tin whisker formation and to develop methods for prevention and minimization. This workshop will provide an overview of the vast literature and the latest development in tin whisker research, from the understanding of the mechanism to the remedies for whisker minimization.
※ 测试锡须的方法（NEMI, JEITA 和E3）
※ What is tin whisker?
※ How does the tin whisker form and grow?
※ Mechanisms of whisker formation.
※ Thermodynamic driving force for whisker formation.
※ Factors affecting whisker formation (nucleation and growth).
※ Methods for testing whisker (NEMI, JEITA and E3).
※ Remedies for whisker prevention.
陈旭博士,朗讯科技公司可靠性研究部可靠性工程师。在半导体,电子封装，电子制造，表面镀层及涂覆，失效模式分析和可靠性评估方面具有丰富经验。陈博士 曾获得多个奖项，包括在SUR/FIN2000的“Excellence in Presentation Awards”和在APEX会议的“Best Paper Award”。陈旭1983年上海同济大学获得化学学士学位,1991年德国波鸿的鲁尔大学获得博士学位,担任过Enthone, Cookson Electronics公司的高级科学家，朗讯科技公司的项目领导人/MTS ，在Hoechst 研究和技术中心担负研发工作。
Dr. Chen Xu is a reliability engineer with Lucent Technologies Reliability Research Department. He has extensive experience in the fields of semiconductor and electronic packaging, electronic manufacturing, surface finishes and coatings, failure mode analysis and reliability assessment. Dr. Xu has received several awards including the Excellence in Presentation Awards at SUR/FIN 2000 and Best Paper Award at APEX conference in 2002 and 2004. He is the author and coauthor of more than 90 publications and over 30 presentations. Chen Xu received his BS Degree in Chemistry from Tongji University in Shanghai, China in 1983 and his Ph.D. in Physical Chemistry from Ruhr-University Bochum, Germany in 1991. Dr. Xu’s career also includes Senior Scientist with Enthone, Cookson Electroncis, project leader/MTS with Lucent Technologies and R&D positions at Hoechst Research and Technology Center.