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中国电子专用设备工业协会
美国SMTA深圳办事处
李宁成博士“无铅焊接—材料、工艺、解决问题和可靠性”学术讲座
前言：
这一课程强调实施无铅焊接焊接的必备知识。包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。此外，还讨论失效模式，挑战和解决办法。
This course emphasizes on the technical knowledge required for implementing lead-free soldering. It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering. Furthermore, it discusses the failure modes, challenges, and solutions for addressing those issues.
授课对象：
本课程着力推荐给以下工作人员：企业家和主管官员、环保专员、元件、封装、设计、材料、工艺、设备、可靠性、产品质量和品质管理、制造、无铅供应商、销售工程师和销售经理和所有涉及到使用无铅焊接和焊接工艺的技术人员。
开课时间：2006年4月1日-2日
开课地点：深圳市南山区科技园南区清华研究院
培训费用：会员价：￥2000元/人 非会员价：￥2300元/人
含书会员价：￥2200元/人 含书非会员价：￥2500元人
(四人以上团体报名可获得非会员价的8折优惠)
（含教材费、听课费、咨询费、培训证书费、工作午餐费、茶水费，其余食宿交通自理 ）
咨询电话：（0755）8619-6415 8619-6417 8619-6419
联络传真：（0755）8619-6414
联系人:徐桃英，沈丽，郭艳梅 |
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本课程将涵盖以下主题：
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主题 |
Topics |
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1． 无铅法规和实施状态
2． 无铅合金
3． 无铅表面镀层
4． 无铅器件
5． 无铅基板---刚性和柔性的
6． 无铅焊接的回流工艺
7． 无铅波峰焊
8． 无铅选择焊
9． 无铅返工与返修
10． 无铅焊接检测
11． 铅鉴定
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1. Lead-free legislation and implementation status
2. Lead-free alloys
3. Lead-free surface finishes
4. Lead-free components and substrates
5. Lead-free substrates – rigid and flex
6. Reflow processes of lead-free soldering
7. Lead-free wave soldering
8. Lead-free selective soldering
9. Lead-free rework
10. Lead-free soldering inspection
11. Lead identification |
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12． 无铅焊接的转变阶段
13． SAC焊点的脆性
14． 无铅BGAs和CSPs底部填充
15． 锡须形成机制和解决办法
16． 无铅回流焊中的空洞形成机制和控制
17． 进一步解决无铅焊接问题
18． 无铅焊点可靠性建模
19． 无铅焊点失效模式
20． 无铅焊接的其它挑战
21． 供应链 |
12. Transition stages of lead-free soldering
13. Fragility of SAC solder joints
14. Underfilling lead-free BGAs and CSPs
15. Tin whisker formation mechanism and solutions
16. Voiding mechanisms and control at lead-free reflow soldering
17. Further troubleshooting lead-free soldering
18. Modeling for reliability of lead-free solder joints
19. Failure modes of lead-free solder joints
20. Additional challenges of lead-free soldering
21. Supply chain |
讲师-李宁成博士
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李宁成博士 1986年至今，任职于美国铟科技公司，现任该公司副总裁。在此之前，任职于Wright Patterson空军基地材料实验室（1981-1982），Morton化学（1982-1984）和SCM（1984-1986）。他在SMT助焊剂和焊锡膏方面有20多年的研究经验。此外，他在底部填充胶和粘接剂方面有着丰富的经验。现今，他的研究领域涉及到电子和光电子的互联与封装应用的先进材料，并且侧重于高性能与低成本。
李宁成博士于1981年在美国阿克伦城大学获得结构-性质关系聚合体科学博士学位。1976年，他在Rutgers 大学专修有机化学。1973年他在台湾国立大学获得化学学士学位。
李宁成博士最新出版了《回流焊工艺和解决方案：SMT，BGA，CSP和Flip Chip技术》。合著编写了《无铅，无卤素，电子制造和导电胶材料》。同时，他还编写了一系列关于无铅焊接书籍的章节。他荣获SMTA两项大奖，其中一项是SMT杂志的最佳国际会议论文奖。2002年荣获SMTA名望会员，2003年荣获焊接技术的无铅合作奖。他就职于SMTA执行董事会。此外，他还是《焊接与表面组装技术》和《世界SMT与封装》的编辑顾问。他有众多的出版物以及经常应邀在全世界许多国际会议或者讨论会上作学术报告，发表演讲和简短课程。
Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Wright Patterson Air Force Base Materials Laboratory (1981-1982), Morton Chemical (1982-1984), and SCM (1984-1986). He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
He received his PhD in polymer science on structure-property relationships from University of Akron in 1981. Prior to Akron period, he has studied organic chemistry at Rutgers University in 1976. He received a BS in chemistry from National Taiwan University in 1973.
Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received two awards from SMTA and one from SMT Magazine for best proceedings papers of international conferences. He is honored as 2002 SMTA Member of Distinction, and received 2003 Lead-Free Co-Operation Award from Soldertec. He serves on the board of director for SMTA. Among other editorial responsibilities, he also serves as one of the editorial advisory boards of Soldering & Surface Mount Technology, and Global SMT & Packaging. He has numerous publications and frequently gives presentations, invited seminars, keynote speeches, and short courses worldwide on those subjects at many international conferences or symposiums. |
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银行资料
开户银行：招商银行深圳市南油支行
公司名称：深圳市拓普达资讯有限公司
公司账号：2583640910001
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