中国电子学会SMT咨询专家委员会办事处

中国电子专用设备工业协会

美国SMTA深圳办事处

大力发展面向“世界工厂”的职业教育和培训

---

您能从此课程中学到哪些内容：
   此课程涵盖了高可靠无铅焊点、材料选择的详细要求。焊点可靠性包括焊点机械特性、多种金属面化合物结构的生长特性、老化条件，以及金属面化合物对可靠性的影响；失效模式、热循环可靠性、焊点强度、详细地分析金属面化合物的热与压力变化过程与焊点脆性的关系，介绍了减少焊点脆性的新无铅焊接材料、分析了电迁移性、腐蚀性以及锡须等现象。此外，还将讨论通孔焊接焊点的可靠性，特别是对厚的PCB板实现高可靠性的建议。重点强调焊点的哪些不同的因素会造成焊点的失效，以及如何选择恰当的焊料合金与表面镀层模式来实现高可靠性，介绍未来合适的合金与助焊剂来迎接小型化的挑战。

What You Can Learn From This Course:

This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints. The reliability discussed includes joint mechanical properties, development of type and extent of intermetallic compounds (IMC) under a variety of material combinations and aging conditions and how those IMCs affect the reliability. The failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history will be addressed in details, and novel alloys with reduced fragility will be presented. Electromigration, corrosion, and tin whisker will also be discussed. Furthermore, the reliability of through-hole solder joints will be reviewed, and recommendation will be provided, particularly for thick boards. The emphasis of this course is placed on the understanding of how the various factors contributing to the failure modes, and how to select proper solder alloys and surface finishes for achieving high reliability. Also will be presented are the desirable future alloys and fluxes in order to meet the challenge of miniaturization.

谁应该参加此课程：
任何关心实现高可靠性无铅焊点以及想了解如何实现高可靠性无铅焊点的人都应该参加！

---

深圳开课时间：2008年4月12日至13日 两天课程

开课地点：深圳市南山区科技园南区清华研究院

培训费用：会员价：￥2000元/人 非会员价：￥2300元/人 

含书会员价：￥2200元/人  含书非会员价：￥2500元人

(四人以上团体报名可获得非会员价的8折优惠)（含教材费、听课费、咨询费、培训证书费、工作午餐费、茶水费，其余食宿交通自理 ）
咨询电话：（0755）86196415   86196417 
联络传真：（0755）8619-6453 

联系人：沈丽、何娟娟、罗丹、李群、董艳、王佰纯
E-mail：sales@toptouch.com.cn; sales@smte.net.cn

---

证  书：由中国电子专用设备协会颁发培训证书（在深圳市拓普达资讯有限公司和中国电子专用设备协会有备案，并可在www.smte.net查询）。请自备一寸红色背景彩照一张.

---

本课程将涵盖以下主题：

主题	Topics
1． 无铅焊料的执行情况 2． 常用的无铅焊接材料  1) 常用的无铅焊料合金  2) 常用的无铅表面镀层 3． 表面镀层  1) 化学镀镍浸金  2) 浸银    a. 微孔结构    b. 化学浸蚀效应   4．机械特性  1) 剪切与拉伸强度  2) 延展性 5． 金属面化合物  1) 铜与镍的交互作用  2) 在锡银铜中铜含量的影响  3) 在铜焊盘中镍的影响  4) 其他合金的影响  5) 热的影响  6) 界面空洞的形成  6． 失效模式  1) 颗粒边界变化与气泡现象   2) 颗粒的形成  3) 颗粒状方向  4) 引脚污染  5) 混合合金    6) 界面空洞 7． 热循环可靠性  1) 热循环测试环境的影响  2) PCB表面镀层铜对镍的影响  3) 回流温度的影响  4) SMT返工焊点的可靠性	1.    Implementation Status 2.    Prevailing Materials 1). Prevailing Solder Alloys 2). Prevailing Surface Finishes   3.      Surface Finishes Issues 1). Issues of ENIG 2). Issues of ImAg a.  Microvoiding mechanism b.  Etchant chemistry effect   4.      Mechanical Properties 1). Shear & Pull Strength    2).  Creep   5.      Intermetallic Compounds 1). Interaction of Cu and Ni 2). Effect of Cu Content in SAC 3).    Effect of Ni in Cu Pad 4).    Effect of Alloy Additives 5).    Effect of Heat History 6).    Formation of Interfacial Void   6.      Failure Modes 1).    Grain Boundary Sliding & Cavitation 2).    Grain Coarsening 3).    Grain Orientation 4).    Lead Contamination 5).    Mixed Alloys 6).    Interfacial Voiding   7.      Thermal Cycle Reliability 1).    Effect of Thermal Cycle Test Condition 2).    Effect of PCB Surface Finish Cu vs Ni 3).    Effect of Reflow Temperature 4).    Reliability of Reworked SMT Joints
8． 通孔焊点的可靠性   1) 大而厚的PCB板  2) 部分填充的通孔 9． 脆性  1) 无铅焊点的脆性   2) 元件镀层对焊点脆性的影响  3) 合金、PCB表面镀层、回流情况以及张力比率对无铅焊点脆性的影响  4) 金属面化合物厚度对无铅焊点脆性的影响  5) 常温老化对无铅焊点脆性的影响   6) 热循环对无铅焊点脆性的影响  7) 金属面化合物的结晶形态对无铅焊点脆性的影响 78）减少焊点脆性的新型合金    a. 在锡银铜合金中搀杂锰、钛（铋、铈、钇）等    b. 锡银镍磷，锡银铜    c. 在锡银铜（Sn1.0Ag0.1Cu)中搀杂镍    d. 在锡银中搀杂钴、铂、镍等   10．可靠性——电迁移   1) 电迁移和温度对阻抗的影响  2) 电流密度和背应力对金属面化合物厚度的影响  3) 电流对金属化合物厚度、焊点温度与张力的影响  4) 电迁移对机械性能的影响  5) Cu UBM厚度对电迁移的影响 11． 可靠性——腐蚀  1) 锡银铜405  2) PWB镀层的抗腐蚀能力 12． 锡须 13． 未来无铅合金——迎接电子制造微型化的挑战 14． 未来的助焊剂	8.      Reliability of Through-Hole Joints 1).    Large and Thick Board 2).    Partially Filled Through-Hole   9.      Fragility 1).    Fragility of Lead-Free Solder Joints 2).    Effect of Component Finish  3).    Effect of Alloy, PCB Surface Finish, Reflow History, and Strain Rate 4).    Effect of IMC Thickness 5).    Effect of Isothermal Aging 6).    Effect of Thermal Cycling 7).    Effect of Intermetallic Morphology 8).    Novel Alloys with Reduced Fragility a.       Mn, Ti, (Bi, Ce, Y) Dopants on SnAgCu b.      SnAgNiP, SnAgCuP c.       Ni, In Dopants on Sn1.0Ag0.1Cu d.      Co, Pt, Ni Dopants on SnAg   10.  Reliability – Electromigration 1).    Influence of Electromigration and Temperature on Resistance 2).    Effect of Current Density & Back Stress on IMC Thickness 3).    Effect of Current on IMC Thickness, Joint Temp and Strain 4).    Effect of Electromigration on Mechanical Property 5).    Effect of Cu UBM Thickness on Electromigration   11.  Reliability – Corrosion 1).    SAC405 2).    Corrosion Resistance of PWB Finishes   12.  Tin Whisker   13.  Future Lead-Free Alloys - Meeting Challenges of Miniaturization   14.  Future Fluxes

---

讲师-李宁成博士

李宁成博士 1986年至今，任职于美国铟科技公司，现任该公司副总裁。在此之前，任职于Wright Patterson空军基地材料实验室（1981-1982），Morton化学（1982-1984）和SCM（1984-1986）。他在SMT助焊剂和焊锡膏方面有20多年的研究经验。此外，他在底部填充胶和粘接剂方面有着丰富的经验。现今，他的研究领域涉及到电子和光电子的互联与封装应用的先进材料，并且侧重于高性能与低成本。     李宁成博士于1981年在美国阿克伦城大学获得结构-性质关系聚合体科学博士学位。1976年，他在Rutgers 大学专修有机化学。1973年他在台湾国立大学获得化学学士学位。      李宁成博士最新出版了《再流焊工艺和缺陷侦断：SMT，BGA，CSP和Flip Chip技术》。合著编写了《无铅，无卤素和导电胶材料的电子制造》。同时，他还编写了一系列关于无铅焊接书籍的章节。他荣获SMTA两项大奖和一项SMT杂志的最佳国际会议论文奖。2002年荣获SMTA杰出会员，2003年荣获Soldertec的无铅合作奖。2006年荣获CPMT特殊技术成就奖。他就职于SMTA执行董事会。此外，他还是《焊接与表面组装技术》、《世界SMT与封装》的编辑顾问，和IEEE电子封装制造的副编辑。他有众多的出版物以及经常应邀在全世界许多国际会议或者讨论会上作学术报告，发表演讲和简短课程。 Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Wright Patterson Air Force Base Materials Laboratory (1981-1982), Morton Chemical (1982-1984), and SCM (1984-1986). He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.     He received his PhD in polymer science on structure-property relationships from University of Akron in 1981. Prior to Akron period, he has studied organic chemistry at Rutgers University in 1976. He received a BS in chemistry from National Taiwan University in 1973.        Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received two awards from SMTA and one from SMT Magazine for best proceedings papers of international conferences. He is honored as 2002 SMTA Member of Distinction, and received 2003 Lead-Free Co-Operation Award from Soldertec, and received 2006 Exceptional Technical Achievement Award from CPMT. He serves on the board of director for SMTA. Among other editorial responsibilities, he serves as one of the editorial advisory boards of Soldering & Surface Mount Technology, Global SMT & Packaging, and as associate editor for IEEE Transactions on Electronics Packaging Manufacturing. He has numerous publications and frequently gives presentations, invited seminars, keynote speeches, and short courses worldwide on those subjects at many international conferences or symposiums.