Dongkai received his BS degree in Mechanical Engineering from Tsinghua University, China, Ph.D. degree in Materials from the University of Oxford, U.K., and MBA degree from the San Jose State University. He conducted post-doctoral teaching and research at the University of Cambridge and then at The University of Alabama, and lectured at the Wayne State University as Adjunct Faculty.
Dongkai worked for 10 years at Ford Motor Co. / Visteon Corporation as Senior Technical Specialist, Supervisor of Advanced Electronics Manufacturing, and Manager of Supplier Quality, before he joined Flextronics International in 2001 where he is currently Director for Advanced Process Technology with the Corporate Technology Group.
Dongkai has published 1 book and over 150 papers (including many journal publications and several book chapters), has given numerous technical presentations and keynotes, and his latest book on lead-free solder interconnect reliability will be published soon. He has 19 U.S. and international patents issued and a number of U.S. and international patents pending. He is currently a regular columnist for the “Global SMT & Packaging” magazine.
Dongkai is a senior member of IEEE and SME, and actively participates in professional organizations and consortia, and has chaired technical sessions and panels at numerous conferences.
Dongkai has received a number of recognitions for his contributions to the industry, including the “Total Excellence in Electronics Manufacturing Award” and the “Outstanding Young Manufacturing Engineer Award” from the Society of Manufacturing Engineers (SME), and the “Soldertec Lead-Free Soldering Award”. He is listed in “American Men & Women of Science”, “Who’s Who in America”, and “Who’s Who in Science & Engineering”.