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上官东恺讲师简介

【来源:深圳市拓普达资讯有限公司培训部】【编辑:toptouch】【时间: 2006-6-9 15:25:54】【点击:

上官东恺取得了清华大学机械工程学位,后在英国牛津大学取得材料学博士学位,并在圣荷西州立大学取得了MBA硕士学位。他先后在剑桥大学和阿拉巴马州立大学进行博士后教学和研究工作,并曾在韦恩州立大学授课。

上官东恺在福特汽车公司及Visteon公司工作了十年之久,曾担任高级技术专家、先进电子制造主管、供应品质管理经理。他于2001年加入伟创力国际公司,目前担任该公司总部高级工艺技术部总监。

上官东恺已发表了一本专著及150多篇论文(登载于很多杂志和期刊上),详述了很多关键技术及技术难点。他撰写的有关无铅焊料可靠性的一本新书将于近日出版。他拥有20项美国及国际专利,还有多项正在申请的专利。他还是“全球SMT及封装”杂志的专栏作家。

上官东恺是IEEE和SME的高级会员,他积极参与各种专业组织和合作,在众多的研讨会上主持技术论坛及座谈。

由于他对业界的突出贡献,上官东恺获得了多项赞誉,包括国际制造工程师学会(SME)授予的“电子制造全面卓越奖”和“杰出年轻制造工程师奖”;及Sldertec中心授予的“Sldertec无铅焊接奖”。他还被收录于“美加科学家名人录”、“美国名人录”及“科学工程名人录”。

Dongkai received his BS degree in Mechanical Engineering from Tsinghua University, China, Ph.D. degree in Materials from the University of Oxford, U.K., and MBA degree from the San Jose State University. He conducted post-doctoral teaching and research at the University of Cambridge and then at The University of Alabama, and lectured at the Wayne State University as Adjunct Faculty.

Dongkai worked for 10 years at Ford Motor Co. / Visteon Corporation as Senior Technical Specialist, Supervisor of Advanced Electronics Manufacturing, and Manager of Supplier Quality, before he joined Flextronics International in 2001 where he is currently Director for Advanced Process Technology with the Corporate Technology Group.

Dongkai has published 1 book and over 150 papers (including many journal publications and several book chapters), has given numerous technical presentations and keynotes, and his latest book on lead-free solder interconnect reliability will be published soon. He has 19 U.S. and international patents issued and a number of U.S. and international patents pending. He is currently a regular columnist for the “Global SMT & Packaging” magazine.

Dongkai is a senior member of IEEE and SME, and actively participates in professional organizations and consortia, and has chaired technical sessions and panels at numerous conferences.

Dongkai has received a number of recognitions for his contributions to the industry, including the “Total Excellence in Electronics Manufacturing Award” and the “Outstanding Young Manufacturing Engineer Award” from the Society of Manufacturing Engineers (SME), and the “Soldertec Lead-Free Soldering Award”. He is listed in “American Men & Women of Science”, “Who’s Who in America”, and “Who’s Who in Science & Engineering”.


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