Abstract: The rapid development of high density packaging technology has already bring up the new challenge to inspection technology for solder paste printing. For replying challenge, the new inspection technology continuously appears, 3D AOI inspection is one of them, it can be used to  measure the height, area and volume of solder paste, and effectively controls quality of solder paste printing. This paper simply introduces the theory and the application of 3D AOI inspection, indicates that 3D AOI inspection is necessary method to guarantee the quality of electronics assembly.  

Keywords: Solder paste printing; Inspection; 3D AOI

焊膏印刷是SMT的第一道工序，它影响着后续的贴片、再流焊、清洗、测试等工艺，并直接决定着产品的可靠性。据统计，电子产品一半以上的缺陷和失效与焊膏印刷相关，因此在印刷完成后对焊膏印刷效果进行检查非常必要。传统的做法是在印刷完成之后安排一个工位进行人工检查，对不合格品进行修补或剔除。但随着细间距(FPT)、芯片尺寸封装(CSP)、0201等技术的迅速发展，对焊膏印刷进行定性判断已不能满足需要，必须要对其作定量分析，包括印刷的高度（厚度）、宽度、体积等，这就要用到先进的测量仪器，例如3D AOI等，可以有效发现印刷过程中的缺陷，降低返修成本，大幅度提高PCB组装厂商的生产效益。

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